PD 955 M SMT-Adhesive

Thermosetting Polymer SMT-Adhesive for High-Speed Dispensing

Description

PD 955 M is a thermosetting single-component, solvent-free polymer adhesive, developed especially for the surface mounting of SMT components on to PCBs and for use on bare substrates. The rheology is especially adapted for high-speeddispensing. It allows for very low Z-Height-returns.

Special advantages

-Very wide processing window, no tendency to string. -Specially developed for high-speed dispensing. -Dispensing with very low Z-Height-return possible. -Form stable glue dots. -Excellent adhesion with standard and also with

difficult-to-glue components.

-Very low humidity absorption. Steep temperature increases and very short curing times are possible without danger of formation of air bubbles or worse adhesion.

-High surface insulation resistance (SIR). -Constant batch-to-batch quality.

Physical characteristics

Colour: red Density: 1.2 g/cc Homogeneity: no particle >50 µm Adhesion: 25 N/mm2 at room

temperature, after curing in conventional box oven, 5 min /125°C, Cu-nail on SO component, with a low-stress incapsulation compound.

Viscosity

Shear rate D Viscosity ascending curves

[s-1] [Pa·s] PD955M 30 10-40 Haake Rotovisco RV 20, PK 100, PK I/2°T, plate/cone, without border, temperature: 23 °C. Program: ascending curve 0-40 s-1, 6 min.

Electrical characteristics

Surface insulation resistance and electrolytic corrosion property: see reverse.

Processing

The adhesive is suitable for machine and manual dispensing.

Curing

The standard curing conditions are: 125°C / 3’. Max. curing temperature should not be higher than 200°C. The minimum* curing times are shown in the following list.

100 °C 125°C 150°C 180°C
8 ' 3 ' 1.5 ' 1 '

* Optimal curing conditions depend on the curing oven.

Cleaning

Before curing: The uncured adhesive can be removed with Zestron HC and other Zestron and Vigon cleaning materials -see separate application recommendations. The cleaned parts must be completely dry before installing them in the machine.

After curing: Because of the known residual thermoplasticity of the cured adhesive, defective components can be easily replaced by heating (with hot air) the cured adhesive joint above 100°C. After removing the component (torsion movement), the hot air should be focused on the remaining adhesive in order to remove it with a sharp tool.

Packing

The adhesives PD 955 M can be filled in various machine-specified syringes.

PD_955M_1.0

PD 955 M SMT-Adhesive

Thermosetting Polymer SMT-Adhesive for High-Speed Dispensing

Storage

Storage time: 6 months in a refrigerator, at a storage temperature of 5 12°C. Storage in a refrigerator is recommended. Remark: Storage at temperatures >30°C should be

avoided.

See reverse for additional information

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment,and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versionscan always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infrresulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests todetermine materials suitability for a particular application.

Europe North America Asia
W.C. Heraeus GmbH & Co. KG Heraeus Incorporated Heraeus Ltd
Circuit Materials Division Circuit Materials Division Heraeus Technology Centre
Heraeusstr. 12-14 24 Union Hill Road 30 On Chuen Street
63450 Hanau W. Conshohocken, PA 19428 On Lok Tsuen
Germany USA Fanling, NT., Hong Kong
Tel: +49 (6181) 35-4233 Tel: +1 (610) 825-6050 Tel: + (852) 2675-1200
Internet: www.4cmd.com E-Mail: techservice@4hcd.com E-Mail: pdf@heraeus.com.hk

PD_955M_1.0

PD 955 M SMT-Adhesive

Thermosetting Polymer SMT-Adhesive for High-Speed Dispensing

Test results with the SMT-adhesive PD 955M according to Siemens Norm SN 59651** Report date: April 29, 1996

Item:* Test Requirements Results
2.1 Characteristics good visible colour, filled in syringes bubble-free, particle size < 50 µm red colour bubble-free particles < 30 µm
2.2 Viscosity acc. to the agreement passed
3.1 Storage Conditions acc. to manufacturer´s data 6 months passed
3.2 Open potlife min. 8 hours passed
3.3 Dispensability reproducible -without stringing passed
3.4 Tack time min. 8 hours passed
3.5 Components’ adhesion before curing of adhesive position change � 0.15 mm < 0.1 mm
3.6 Cleanability completely cleanable Zestron HC
4.1 Curing characteristics acc. to manufacturer´s data 125 °C, 3 min.
4.2 Electrolytic corrosion effect according to IEC 426 known value should be no worse than A 1.4 passed
4.3. Surface insulation resistance (comb sample test) > 1.1010 Ohm 3.4.1011 Ohm
4.4 Electrolytic corrosion effect (comb sample test) no blistering, no dendritic growth passed
4.5 Mass loss at working temperature mass loss � 1 % passed
4.6 Adhesive spreading during curing increase of diameter � 10% passed
4.7 Components’ adhesion after curing of adhesive > 5 N/mm2 per component 0603: 15.6 N/mm2 0805: 14.4 N/mm2 1206: 15.9 N/mm2 SOT23: 11.2 N/mm2 SO14: 30.0 N/mm2
4.8 Components’ adhesion after curing of adhesive (measured in soldering bath) > 1 N with the component 1206 1.38 N
4.9 Reparability SMD replacement without damage passed

*According to SN 59651, Issue November 1994. **The tests were performed in the Siemens Central Laboratory ZPL1TW22 in Berlin. Person who performed the tests: Mr. Trodler

Issue from March 31,1999 AZM-TA

PD_955M_1.0

Thermosetting Polymer SMT-Adhesive for High-Speed Dispensing

Adhesion is sufficient at 85 % full cured strength.

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment,and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versionscan always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infrresulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests todetermine materials suitability for a particular application.

Europe North America Asia
W.C. Heraeus GmbH & Co. KG Heraeus Incorporated Heraeus Ltd
Circuit Materials Division Circuit Materials Division Heraeus Technology Centre
Heraeusstr. 12-14 24 Union Hill Road 30 On Chuen Street
63450 Hanau W. Conshohocken, PA 19428 On Lok Tsuen
Germany USA Fanling, NT., Hong Kong
Tel: +49 (6181) 35-4233 Tel: +1 (610) 825-6050 Tel: + (852) 2675-1200
Internet: www.4cmd.com E-Mail: techservice@4hcd.com E-Mail: pdf@heraeus.com.hk
PD_955M_1.0